Flip-chip Mounter
The reclaimer arm will transport the dies to the wafer expanding device, and substrates reclaimer will transport the substrates to the conveyor belt which would send the substrate to the working area at the same time. The conveyor belt will transport two substrates at once under the correction of machine vision. On the other side, the ejector pin will jack up the DIE and the Flip-action arm will draw the DIE and rotate it 180 degrees to let mounter arm take away the DIE and move it to scaling powder station. After dipping flux, mounter arm will put DIE on the substrate precisely under the correction of machine vision. When two substrate were full loaded ,those will be transported to the receiver same as the wafer.
Application:
Chip packaging (flip chip process)
Features
Device parameters
| Item | Parameter |
| name | Flip-chip mounter |
| model | DFC-1202A |
| production capacity（UPH） | 6000(Related to process parameter requirements) |
| equipment accuracy（μm） | ±5μm |
| Cohesive force | 1N-40N |
| wafer size | 12inches maximum |
| locating method | fixed +moving phtographing |
| material stack | 100(8mm as standard) |
| suction type | NXT compatible electricity |
| automatically suction exchange | support |
| work power | 4.5KW |
| power | three-phase AC380 |
| air pressure | 0.5-0.7MPa |
| equipment size | 3200x1310x1708mm（L*W*H） |
| equipment weight | ≈ 2600KG |
