Wafer Dicing Machine
The wafer dicing machine is used to cut the wafer and separate each die. Attached with a layer of wafer mount on its back, the wafer then will be sent to the wafer dicing machine through an automatic feeding mechanism. After cut by a high-speed rotating diamond blade, the dies will attache on the wafer mount in good order and then be transported to the cleaning area by a transport arm for centrifugal cleaning. The dies cleaned up by the ionized water (DI pure water) and discharged static electricity will be sent back to the cassette by the transport arm .
Features
Device parameters
| Item | Parameter | |
| name | wafer dicing machine | |
| model | QWD-1202A | |
| maximum size of workpiece | φ300mm | |
| X axis | cutting range | 310mm |
| Feed speed input range | 0.1-1000mm/s | |
| Y1·Y2 axis | cutting range | 310mm |
| single step | 0.001mm | |
| Y axis positioning accuracy |
within 0.003mm; single deviation within 0.002 mm |
|
| Z1·Z2 axis | effective stroke | 14.7mm(with φ2 blade) |
| movement resolution | 0.00005mm | |
| repeat accuracy | 0.001mm | |
| maximum blade diameter | φ58mm(When using φ2" cutting knife) | |
| Θ axis | maximum rotation angle | 270° |
| spindle | rated power | 1.2at 600000min-1KW |
| Rated torque | 0.19N·m | |
| rotation range | 6000-60000 | |
| maximum frame siza | 8-12 nches | |
| other specifications | power | three-phase AC380 |
| equipment size | 1850*1520*1850mm（L*W*H） | |
| equipment weight | about 2500KG | |
