Guangdong Qrobot Semiconductor Equipment Co., LTD

    Guangdong Qrobot Semiconductor Equipment Co., Ltd.​, founded in 2016 and based in Dongguan, China’s manufacturing hub, specializes in the R&D, production, and sales of high-end semiconductor packaging equipment. Committed to semiconductor localization and original innovation, Qrobot pioneered China’s first 12-inch fully automatic wafer saw in 2018. Over eight years of R&D, eight product iterations, and four years of production-line validation, the company has developed a comprehensive portfolio including wafer saws, IC package saws, high-speed sorting machines (JigSaw), and flip-chip die bonders (FC). These products are deployed across nearly 20 packaging clients, achieving precision within 2 micrometers and reliability comparable to international standards.

    Qrobot adheres to the philosophy of “perfecting oneself to create value for clients,” embracing long-termism and craftsmanship. With its “eight years of honing a single sword” approach, the company delivers high-performance equipment, short lead times, cost efficiency, and responsive service, empowering domestic semiconductor packaging clients to secure supply chains and optimize costs.

    Over the next three years, Qrobot aims to deepen its focus on advanced packaging and become a leader in China’s semiconductor equipment localization. The company plans to file for a STAR Market (Sci-Tech Innovation Board) IPO in 2027, further bolstering China’s semiconductor self-reliance.